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LED全彩屏控制系统中高速数据传输和数据接收部分的设计

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    发表于 2016-1-14 07:55:18 | 只看该作者 回帖奖励 |倒序浏览 |阅读模式
    中文摘要
    随着科学技术的发展,如今半导体发光二极管的性能达到了更高的水平。半
    导体发光器件耗电量小且发光效率高,尤其蓝色超高亮 LED 的出现,使得 LED
    器件的光谱覆盖了全部自然光的范围,其应用也扩展到了制作全彩色大型平板显
    示系统,并受到广泛关注。用 LED 器件组成电子显示屏,不但色彩绚丽而且其
    制作尺寸几乎不受限制,可以达到几十甚至几百平方米以上,可应用于室内外各
    种公共场合显示文字、图形、图像、动画、视频图像等信息,具有较强的广告渲
    染力和震撼力,美化和丰富了人们的生活环境。
    传统 LED 显示系统的控制以单片机为核心,功能较为简单,当需要进行数
    据处理时,单片机的处理能力就更显不足,不能满足 LED 显示屏发展的需要。
    本文将介绍一种基于 CPLD 控制平台的 LED 全彩色显示屏控制系统。论文首先
    介绍了 LED 显示技术和系统设计,然后详细介绍了系统的高速数据传输部分和
    数据接收部分的实现过程。根据数据传输的速率要求和 LED 屏箱体间的连接特
    点,本文设计了两种传输方案。第一种,使用 HDMP-1022 和 HDMP-1024 专用
    传输芯片的设计方案;另外一种为采用 LVDS 技术配合驱动和均衡器来实现传输
    要求的解决方案。此外,论文还对分控板的系统结构作了详细的介绍,并着重描
    述了采用 CPLD-EPM570 完成主控任务的设计过程。经过对整个系统进行软件仿
    真和硬件实验的结果表明,该设计合理、功能完备,能够完成 600Mbps 的传输
    速率,并在分控板的控制下将图像信息在 LED 灯板上完整地显示,达到了设计
    的要求。
    关键词: LED 平板显示系统 高速数据传输 LVDS CPLD

    ······································································· 21
    3.5 小结················································································································· 22
    第四章 系统硬件电路设计························································································23
    4.1 可编程逻辑器件 ····························································································· 23
    4.1.1 概述·········································································································· 23
    4.1.2 CPLD器件································································································· 24
    4.1.2.1 CPLD的结构······················································································· 24
    4.1.2.2 CPLD的优势······················································································· 24
    4.1.3 FPGA器件································································································· 25
    4.1.4 MAX II系列芯片的特点··········································································· 25
    4.2 LVDS技术及其特点························································································ 28
    4.2.1 LVDS技术及其发展 ················································································· 28
    4.2.2 LVDS技术的特点 ····················································································· 29
    4.2.3 LVDS信号在PCB上的要求 ······································································ 29
    4.2.4 总线LVDS(BLVDS)············································································· 30
    4.3 CAD设计软件 ································································································· 31
    4.3.1 Protel ········································································································· 31
    4.3.2 PADS ········································································································· 31
    4.4 数据传输系统的硬件电路实现 ····································································· 32
    4.4.1 HDMP-1022 和HDMP-1024····································································· 32
    4.4.1.1 工作模式···························································································· 32
    4.4.1.2 硬件电路设计和调试 ········································································ 33
    4.4.2 使用LVDS解决方案的设计····································································· 35
    4.4.2.1 DS92LV16··························································································· 35
    4.4.2.2 驱动器和均衡器················································································· 35
    4.4.2.3 硬件电路实现····················································································· 36
    4.5 分控板的硬件电路设计 ················································································· 38
    4.5.1 IDT71V416S10 ························································································· 38
    4.5.2 硬件电路实现 ··························································································· 38
    4.6 小结················································································································· 39
    第五章 控制系统调试································································································40
    5.1 硬件描述语言HDL(HARDWARE DESCRIBE LANGUAGE)
    [27]
    ····················· 40
    5.1.1 VHDL简介 ································································································ 40
    - ii -目 录
    第一章 绪论··················································································································1
    第二章 LED显示技术的发展和基本原理·································································3
    2.1 LED显示技术的发展历史················································································ 3
    2.2 LED显示技术的基本原理················································································ 4
    2.2.1 灰度扫描的实现
    [1]
    ····················································································· 4
    2.2.2 信息刷新原理
    [1]
    ························································································· 4
    2.2.3 扫描控制电路总体说明············································································· 5
    2.2.4 彩色显示屏的γ校正··················································································· 6
    2.2.5 显示屏均匀性的改造
    [1]
    ············································································· 7
    2.3 小结··················································································································· 8
    第三章 系统总体设计··································································································9
    3.1 系统整体描述··································································································· 9
    3.2 主控板设计简介 ····························································································· 11
    3.2.1 信号采集 ·································································································· 11
    3.2.2 数据的乒乓存储 ······················································································ 11
    3.2.3 反γ校正部分 ···························································································· 12
    3.2.4 主控芯片的功能及器件选择··································································· 12
    3.2.5 数据整合部分 ·························································································· 13
    3.3 数据传输部分································································································· 13
    3.3.1 传输系统的整体要求 ·············································································· 14
    3.3.2 使用HDMP-1022 和HDMP-1024 的设计方案 ······································· 14
    3.3.2.1 HDMP-1022 和HDMP-1024 主要特点·············································· 15
    3.3.2.2 HDMP-1022 的功能结构 ··································································· 15
    3.3.2.3 HDMP-1024 的功能结构 ··································································· 15
    3.3.3 使用LVDS解决方案的设计····································································· 16
    3.3.4 两种方案的特点 ······················································································ 19
    3.4 数据接收部分(分控板) ············································································· 20
    3.4.1 分控板结构 ······························································································ 21
    - i -5.1.2 Verilog HDL简介 ······················································································ 41
    5.1.3 VHDL与Verilog DHL的比较···································································· 42
    5.2 EDA软件及应用 ····························································································· 43
    5.2.1 概述·········································································································· 43
    5.2.2 常用的EDA软件 ······················································································ 44
    5.2.2.1 Altera的可编程逻辑器件设计工具···················································· 44
    5.2.2.2 Modelsim ···························································································· 44
    5.2.2.3 Synplify/Synplify pro ·········································································· 45
    5.2.3 自顶向下的设计方法 ·············································································· 45
    5.3 分控板中CPLD的设计 ·················································································· 46
    5.3.1 接收信号的标准 ······················································································ 46
    5.3.2 乒乓控制信号和写地址产生··································································· 46
    5.3.3 读地址产生 ······························································································ 47
    5.3.4 数据选择和上屏控制信号······································································· 49
    5.3.5 系统完整结构 ·························································································· 50
    5.3.6 CPLD调试结果 ························································································· 50
    5.4 小结················································································································· 51
    第六章 总结和展望····································································································52
    6.1 总结················································································································· 52
    6.2 展望················································································································· 52
    参考文献······················································································································53
    发表论文和科研情况说明··························································································55
    致 谢······················································································································56

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